Crackless smart soldering increases the power and efficiency of the module, and improves the load capacity
Optimized Electrical Parameters
The working current is about 13A, which is perfectly adapted to mainstream string inverters
Optimized Module Size
Module with M10 wafer size uses dual glass and frame packaging to ensure the load of the module, which is suitable for the weight of the module to be carried by two persons, and fully consider the arm span during manual handling
Gallium-doped Technology
Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.
Compatibility of Packaging and Transportation
Mainstream mature packaging solution to achieve high-reliability and low-cost transportation
Bifacial Energy Yield
Higher comprehensive energy yield because of the power generation on the back of the module, which has been widely verified by customers and third parties